Mobile IC Reballing Course – Android Device

Description

10-Day Comprehensive Course Outline: Mobile IC Reballing – Android Device

Day 1: Foundations of Mobile IC Reballing
Day 2: Preparing the Work Environment and IC
Day 3: Stencil Preparation and Solder Paste Application
Day 4: Reballing the IC
Day 5: Cleaning and Quality Control
Day 6: Motherboard Preparation and IC Placement
Day 7: Reflow Soldering and Final Inspection
Day 8: Troubleshooting and Problem-Solving
Day 9: Advanced Reballing Techniques
Day 10: Case Studies and Practical Exercises

Starting from 18 October 2024

Note: Customized and condensed curriculum available for learners travelling long distances or from outside of Dhaka.