About Course
10-Day Comprehensive Course Outline: Mobile IC Reballing – Android Device
Day 1: Foundations of Mobile IC Reballing
Day 2: Preparing the Work Environment and IC
Day 3: Stencil Preparation and Solder Paste Application
Day 4: Reballing the IC
Day 5: Cleaning and Quality Control
Day 6: Motherboard Preparation and IC Placement
Day 7: Reflow Soldering and Final Inspection
Day 8: Troubleshooting and Problem-Solving
Day 9: Advanced Reballing Techniques
Day 10: Case Studies and Practical Exercises
Starting from 27 December 2024
Note: Customized and condensed curriculum available for learners travelling long distances or from outside of Dhaka.
Course Content
Foundations of Mobile IC Reballing
Preparing the Work Environment and IC
Stencil Preparation and Solder Paste Application
Reballing the IC
Cleaning and Quality Control
Motherboard Preparation and IC Placement
Reflow Soldering and Final Inspection
Troubleshooting and Problem-Solving
Advanced Reballing Techniques
Case Studies and Practical Exercises
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